Inline 3D SPI 8030-3L

Koh-Young SPI 8030-3L

Sąlyga: labai geros būklės (naudotas), Gamybos metai: 2018, Extreem snelle en nauwkeurige inspectie voor grootschalige productie Z-resolutie: 0,5 µm Cgjdowkfuujpfx Ah Sjn Z-bereik: tot 30 mm (1,2") Schuine camera’s Aantal megapixelcamera’s: 8 Orthogonale camera Resolutie: 10 µm Beeldveld: 50 mm x 50 mm (2" x 2") Inspectiesnelheid: tot 65 cm²/s Software Gebruikersinterface: Viscom vVision/EasyPro SPC: Viscom SPC (statistische procescontrole), open interface (optioneel) Verificatiestation: Viscom vVerify/HARAN Remote diagnose: Viscom SRC (software remote control) (optioneel) Programmeerstation: Viscom PST34 (optioneel) Systeemcomputer Besturingssysteem: Windows® Processor: Intel® Core™ i7 Printplaatverwerking PCB-afmetingen: 508 mm x 508 mm (20" x 20") Transporteerhoogte: 850 - 950 mm ± 20 mm (33,5" - 37,4" ± 0,8") Breedte-instelling: automatisch Transporttype: enkele baan PCB-klemmen: pneumatisch Bovenste doorvoerhoogte: 50 mm (2") Onderste doorvoerhoogte: 45 mm (1,8"), tot 85 mm (3,3") optioneel; 40 mm (1,6") met PCB-ondersteuning Overige systeemgegevens Positioneer-/handeleenheid: synchrone lineaire motoren Interfaces: SMEMA Stroomvoorziening: 400 V (andere spanningen op aanvraag), 3P/N/PE, 8 A, 4 - 6 bar werkdruk Systeemafmetingen: 994 mm x 1565 mm x 1349 mm (39,1" x 61,6" x 53,1") (B x H x D) Gewicht: 720 kg (1587 lbs)

Gamybos metai: 2016, Sąlyga: naudotas,

Sąlyga: geras (naudotas), Gamybos metai: 2008, Cooling tunnel in return transport Frame transport (no frames included) Cedpferdwl Dex Ah Ssgn Soldering width 330 mm

Gamybos metai: 2016, Sąlyga: labai geros būklės (naudotas), Automatic X-ray Inspection For the inspection of BGA, QFN, THT, LED, LGA, and other solder joints, both visible and hidden. Other features: Includes offline station and repair station OS: Windows 7 Ultra-high speed line-scan CCD detectors Inspection area: 450 mm x 400 mm Imaging: 2D, 2.5D, 3D (layer images with planar CT) PCB dimensions: 60 – 450 x 50 – 400 mm AXI resolution: 6 – 30 μm / px Csdpfx Ajwpuadjh Ssgn AOI: Camera field of view: 42 mm x 42 mm Resolution: 21 μm Inspection height: -3 to 7.5 mm Optics: telecentric Transport height: 950 mm +/- 25 mm Interface: SMEMA Width adjustment: automatic

Sąlyga: beveik kaip naujas (parodų įrenginys), FRONIUS MAGICWAVE 5000 AC DC Komplektacija: ➤ Fronius MagicWave 5000 (500A) ➤ Fronius FK 4000 vandens aušinimas ➤ Fronius WIG rankinis suvirinimo degiklis ➤ Fronius vežimėlis Cgodpfx Aoxhd Tush Ssn ➤ Masės kabelis 3-4 m ➤ Slėgio reduktorius

Gamybos metai: 2015, Sąlyga: paruoštas naudoti (naudotas), Funkcionalumas: visiškai funkcionalus, Model NPS510E Cedpfevuprmsx Ah Sjgn Fully automatic in-line stencil printer with 2D paste inspection - Max. PCB size: 510x450mm - Max. stencil size: 736x736mm - Cycle time (excluding printing process): 8 seconds - Alignment repeatability: 12.5µm at 3 sigma - Squeegee pressure: 4-30kgf - Operator interface: Windows - Dimensions (W x D x H): 1.20 x 1.40 x 1.50m; 900kg Includes: - Stencil cleaning system (wet/dry/vacuum) - CCD camera for 2D inspection of paste print and stencil - Automatic conveyor width adjustment - Support block - Support pins - 2 pcs metal squeegees

Sąlyga: beveik kaip naujas (parodų įrenginys), Gamybos metai: 2024, Funkcionalumas: visiškai funkcionalus, garantijos trukmė: 24 mėnesiai, Multi-frequency ultrasonic cleaning benchtop unit, perfectly suited for cleaning mechanical components, watches, glasses, jewelry, medical devices, and much more. L-30 PLUS 30 liters 28/40KHz 600W / 220 Volt Basket dimensions: 460 x 260 x 150 mm Codpfx Aherwpgfe Ssgn Available immediately from stock in St. Gallen, Switzerland – also available in smaller models! Various sizes available from stock! High-performance ultrasonic component Precise heating elements for constant bath temperature LED control Consistent power and frequency for improved ultrasonic density, which is especially suitable for cleaning high-precision parts

Sąlyga: paruoštas naudoti (naudotas), Solder volume: approx. 400 kg, wave width: 400 mm, usable working width: 390 mm, max. component height: 100 mm, max. PCB length: 562 mm, heating power (solder pot): 9 kW, heat-up time 20°C-250°C/190°C-250°C: 150 min/60 min, transport speed: 2 m/min, power requirement: 18.5 kW. Machine dimensions (L/W/H): approx. 2300 mm/850 mm/1650 mm, net weight: approx. 450 kg. Documentation available. Cedpfx Ahsud Svzj Ssgn

Sąlyga: naudotas, Gamybos metai: 2011, Vorismerítés: 4 alsó zóna • Fűtési szakasz: 1 650 mm • Aktív hűtési szakasz: 800 mm (felső, kétlépcsős) • Lánctüskés szállítórendszer: 5 mm tüskeméret, középső megtámasztással • Szállítási sebesség: 0,2 - 2,0 m/perc (BF termékekhez reálisan: 0,5 - 0,6 m/perc) • Munkaszélesség: 50 - 500 mm • Elektronikus vezérlés: szélességállításhoz és középtámaszhoz • Átjárási magasság: +35 mm / 25 mm • Be- és kijárati hossz: egyenként 700 mm • Kondenzátum-kezelés / Folyamatgáz tisztítása a hűtőzónában • Automatikus lánckenés • ERSAsoft és EPOS Basic modul • Inline kompatibilis • SMEMA szabvány kompatibilis • Szállítási magasság: 940 - 965 mm Elérhető 2025. II. negyedév végétől. Codsv Sy Ruspfx Ah Segn Kérjen további információt!

Sąlyga: naudotas, Gamybos metai: 2015, Vitronics Soltec myReflow 7038 SMD Reflow Soldering Oven Csdpfx Ajuhfm Uoh Sjgn Year of manufacture: 2015 Pin length: 5 mm Pin pitch: 19 mm 10 heating zones 4 cooling zones N2 pressure: 6 bar PCB width: 50 mm - 508 mm Max. component height: 40 mm / 30 mm (top / bottom) Transport height: 832 - 914 mm Width adjustment: electric Software version: 4.0.6.b