Rentgeno patikraSeamark X-ray machine
5600
Rentgeno patikra
Seamark X-ray machine
5600
Gamybos metai
2026
Sąlyga
Naujas
Vieta
Veenendaal 

Rodyti vaizdus
Rodyti žemėlapį
Duomenys apie mašiną
- Įrenginio aprašas:
- Rentgeno patikra
- Gamintojas:
- Seamark X-ray machine
- Modelis:
- 5600
- Gamybos metai:
- 2026
- Sąlyga:
- naujas
Kaina ir vieta
- Vieta:
- De Schutterij 15, 3905 PJ Veenendaal, Nederland

Skambinti
Pasiūlymo informacija
- Sąrašo ID:
- A21303637
- Naujinta paskutinį kartą:
- Data 2026.02.23
Aprašymas
Model: X5600
Application: Micro-focus X-ray inspection of electronic components and assemblies such as BGA, CSP, SMT, wafer, SOP, QFN, sensors, and more.
X-ray Source
Specification Value
Type Sealed micro-focus X-ray tube
Voltage 40–90 kV
Current 10–200 µA
Max. output power 8 W
Microfocus spot size 15 µm
X-ray leakage ≤ 0.5–≤ 1 μSv/h (safety standard)
Detector & Image Quality
Specification Value
Detector type TFT industrial dynamic flat panel detector
Pixel matrix resolution 768 × 768 (sometimes 1.3M pixel report depending on configuration)
Field of View 65 × 65 mm up to ~130 × 130 mm
Image resolution ~5.8 Lp/mm
Frame rate ~20–40 fps
A/D conversion 16-bit
🛠️ Mechanical & System Specifications
Feature Value
Machine dimensions Approx. L850 × W1000 × H1700 mm
Max. sample/size ~280 × 320 mm
Kwodpfsymfmzex Abreu
Net weight Approx. 750 kg
Power supply 220 V 10 A / 110 V 15 A 50–60 Hz
Operating system Industrial PC (Windows 7/10 64-bit)
Inspection mode CNC automatic multi-point inspection
Tilting function ± 30° tilt & 360° rotation for multi-angle inspection
Software & Features
✔ Automatic defect recognition: Y/N, crack, broken wire, offset, bridging, etc.
✔ CNC-controlled automatic inspection over multiple points.
✔ Infrared-based automatic navigation and positioning.
✔ Generation of inspection reports.
✔ Multi-angle & 360° rotation inspection for enhanced defect detection.
Skelbimas verčiamas automatiškai, todėl jame gali būtų vertimo klaidų.
Application: Micro-focus X-ray inspection of electronic components and assemblies such as BGA, CSP, SMT, wafer, SOP, QFN, sensors, and more.
X-ray Source
Specification Value
Type Sealed micro-focus X-ray tube
Voltage 40–90 kV
Current 10–200 µA
Max. output power 8 W
Microfocus spot size 15 µm
X-ray leakage ≤ 0.5–≤ 1 μSv/h (safety standard)
Detector & Image Quality
Specification Value
Detector type TFT industrial dynamic flat panel detector
Pixel matrix resolution 768 × 768 (sometimes 1.3M pixel report depending on configuration)
Field of View 65 × 65 mm up to ~130 × 130 mm
Image resolution ~5.8 Lp/mm
Frame rate ~20–40 fps
A/D conversion 16-bit
🛠️ Mechanical & System Specifications
Feature Value
Machine dimensions Approx. L850 × W1000 × H1700 mm
Max. sample/size ~280 × 320 mm
Kwodpfsymfmzex Abreu
Net weight Approx. 750 kg
Power supply 220 V 10 A / 110 V 15 A 50–60 Hz
Operating system Industrial PC (Windows 7/10 64-bit)
Inspection mode CNC automatic multi-point inspection
Tilting function ± 30° tilt & 360° rotation for multi-angle inspection
Software & Features
✔ Automatic defect recognition: Y/N, crack, broken wire, offset, bridging, etc.
✔ CNC-controlled automatic inspection over multiple points.
✔ Infrared-based automatic navigation and positioning.
✔ Generation of inspection reports.
✔ Multi-angle & 360° rotation inspection for enhanced defect detection.
Skelbimas verčiamas automatiškai, todėl jame gali būtų vertimo klaidų.
Tiekėjas
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