AOISaki
Comet BF18
AOI
Saki
Comet BF18
Pradinė kaina neįskaitant PVM
11 000 €
Gamybos metai
2011
Sąlyga
Naudotas
Vieta
Regensdorf 

Rodyti vaizdus
Rodyti žemėlapį
Duomenys apie mašiną
- Įrenginio aprašas:
- AOI
- Gamintojas:
- Saki
- Modelis:
- Comet BF18
- Gamybos metai:
- 2011
- Sąlyga:
- geras (naudotas)
- funkcionalumas:
- visiškai funkcionalus
Kaina ir vieta
Pradinė kaina neįskaitant PVM
11 000 €
- Vieta:
- Regensdorf, Šveicarija

Skambinti
Pasiūlymo informacija
- Sąrašo ID:
- A18912846
- Naujinta paskutinį kartą:
- Data 2025.05.12
Aprašymas
The BF-Comet is equipped with Saki’s unique line-scan camera imaging concept and vector analysis, allowing it to be used for any inspection (SMD, THT), both before and after soldering.
Thanks to extremely short cycle times, the operator virtually never has to wait, making Saki technology particularly suitable for benchtop applications. The highly precise line-scan camera serves as the central component of the Saki imaging concept.
During image capture, the PCB is moved along one axis beneath the stationary optical system. The line-scan camera records line by line, with each line being imaged four times, alternately using different lighting sources.
Within seconds, an image of the entire PCB is available for inspection and programming.
Variable and constant illumination methods are essential for reliable image analysis. The Saki system features three central, variable units: coaxial (top), offset (side), and low (deep) light sources.
Thanks to the line-scan imaging concept, each component, regardless of its location on the PCB, is always at the same distance and angle to the respective lighting. This results in uniformly illuminated images for analysis.
Lrodpowbgwrsfx Abmou
The so-called top-light unit is a 100% coaxial light source, directed into the vertical camera view via a half-mirror.
This produces a shadow-free 2D image—crucial for dependable solder joint inspection and for inspecting between tall components.
The MLT illumination provides clear color differentiation between tinned/soldered and non-tinned areas.
Areas lacking tin or with poor wetting are displayed in red hues, and can thus be reliably detected using color recognition algorithms.
Foreign objects, such as lost components, solder balls, scratches, damage, etc., can be identified during programming via Saki’s ECD function with minimal additional effort.
Since a complete image of the PCB is already available, this function adds only a few seconds to the inspection time (processing time).
Foreign Object Inspection
- Automatic library creation.
Saki’s KPK function automatically generates a component presence library for unrecognized/new parts tailored to the populated components.
- Automatic X/Y coordinate generation for THT solder joints.
If layout data (CAD) for THT solder joints is not available, this function can automatically generate it using both unsoldered and soldered PCBs.
- Programming wizard
For the entire programming process—from CAD data import and data alignment to library assignment—the software provides a wizard to guide the programmer.
Skelbimas verčiamas automatiškai, todėl jame gali būtų vertimo klaidų.
Thanks to extremely short cycle times, the operator virtually never has to wait, making Saki technology particularly suitable for benchtop applications. The highly precise line-scan camera serves as the central component of the Saki imaging concept.
During image capture, the PCB is moved along one axis beneath the stationary optical system. The line-scan camera records line by line, with each line being imaged four times, alternately using different lighting sources.
Within seconds, an image of the entire PCB is available for inspection and programming.
Variable and constant illumination methods are essential for reliable image analysis. The Saki system features three central, variable units: coaxial (top), offset (side), and low (deep) light sources.
Thanks to the line-scan imaging concept, each component, regardless of its location on the PCB, is always at the same distance and angle to the respective lighting. This results in uniformly illuminated images for analysis.
Lrodpowbgwrsfx Abmou
The so-called top-light unit is a 100% coaxial light source, directed into the vertical camera view via a half-mirror.
This produces a shadow-free 2D image—crucial for dependable solder joint inspection and for inspecting between tall components.
The MLT illumination provides clear color differentiation between tinned/soldered and non-tinned areas.
Areas lacking tin or with poor wetting are displayed in red hues, and can thus be reliably detected using color recognition algorithms.
Foreign objects, such as lost components, solder balls, scratches, damage, etc., can be identified during programming via Saki’s ECD function with minimal additional effort.
Since a complete image of the PCB is already available, this function adds only a few seconds to the inspection time (processing time).
Foreign Object Inspection
- Automatic library creation.
Saki’s KPK function automatically generates a component presence library for unrecognized/new parts tailored to the populated components.
- Automatic X/Y coordinate generation for THT solder joints.
If layout data (CAD) for THT solder joints is not available, this function can automatically generate it using both unsoldered and soldered PCBs.
- Programming wizard
For the entire programming process—from CAD data import and data alignment to library assignment—the software provides a wizard to guide the programmer.
Skelbimas verčiamas automatiškai, todėl jame gali būtų vertimo klaidų.
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