Lazerinio pjovimo staklės

MDI Advanced Processing GmbH LC 800

MDI
Type: Laser Cutting System LC 800
MDI Laser Cutting System
Laser Cutting System LC 800 with UC-2000 Laser Controller and
MSA Control System 9010 LCD for gas detection system
Technical Data:
Machine Data:
Machine dimensions (L x W x H): 2,520 mm x 2,090 mm x max. 1,945 mm
Control cabinet dimensions (W x D x H): 600 mm x 600 mm x 2,000 mm
Machine weight: approx. 2,500 kg
Control cabinet weight: approx. 1,000 kg
Control system: Siemens S7-300 and Siemens Simotion
Spindle drives: THK
Rotary axis: Harmonic Drive
Table size: 810 mm x 680 mm
Max. substrate size: 650 mm x 780 mm
Hnodpfed N Erqex Acuou
Number of cutting heads: 2 (laser for glass cutting, blade for film cutting)
Number of cutting tables: 1
Workpiece clamping: Laser cut frame for laser cutting, vacuum plate for film cutting
Noise level:

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